Curable resin composition, cured product thereof, semiconductor encapsulating material, semiconductor device, prepreg, circuit board, build-up film, build-up substrate, fiber-reinforced composite material, and fiber-reinforced resin molded product 机翻标题: 暂无翻译,请尝试点击翻译按钮。

公开号/公开日
US2017101532 A1 2017-04-13 [US20170101532] / 2017-04-13
申请号/申请日
2015US-15315840 / 2015-02-19
发明人
SHIMONO TOMOHIRO;ARITA KAZUO;
申请人
DIC;
主分类号
IPC分类号
C08G-073/06C08J-005/24C08L-079/04
摘要
(US20170101532) The present invention provides a curable resin composition having excellent fluidity and giving a cured product having excellent physical properties such as heat resistance, moisture resistance/solder resistance, flame retardance, and dielectric characteristics.  The curable resin composition contains a resin (A) which has a benzoxazine structure represented by structural formula (A1) below and an epoxy resin (B) at such a ratio that when the total number of moles of the benzoxazine structure of the structural formula (A1) is α, and the number of moles of epoxy groups in the epoxy resin (B) is β, a ratio [β/α] is 0.1 to 0.5.  <chemistry id="CHEM-US-00001" num="00001"> <img alt="embedded image" file="US20170101532A1-20170413-C00001.TIF" he="19.90mm" id="EMI-C00001" img-content="chem" img-format="tif" wi="69.85mm"/> </chemistry>
机翻摘要
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地址
代理人
代理机构
;
优先权号
2014JP-0122402 2014-06-13 2015WO-JP54593 2015-02-19
主权利要求
(US20170101532) 1. A curable resin composition comprising a resin (A) which has a benzoxazine structure represented by structural formula (A1) below and an epoxy resin (B) as essential components, wherein when the total number of moles of the benzoxazine structure in the resin (A) is alpha , and the number of moles of epoxy groups in the epoxy resin (B) is beta , a ratio [(beta )/(alpha )] is 0.1 to 0.5, [in the structural formula (A1), Ar1 represents a tetravalent aromatic group, Ar2 represents a divalent aromatic group, L represents a divalent linking group, x represents an average repeating number of 0.25 to 5.0, and O*1 atom and C*1 atom represent bonds to adjacent carbon atoms of an aromatic group represented by Ar1, and O*2 atom and C*2 atom represent bonds to adjacent carbon atoms of an aromatic group represented by Ar2].00013
法律状态
(US20170101532) LEGAL DETAILS FOR US2017101532  Actual or expected expiration date=2035-02-19    Legal state=ALIVE    Status=PENDING     Event publication date=2015-02-19  Event code=US/APP  Event indicator=Pos  Event type=Examination events  Application details  Application country=US US15315840  Application date=2015-02-19  Standardized application number=2015US-15315840     Event publication date=2015-02-19  Event code=US/EXMR  Event type=Administrative notifications  USPTO Examiner Name Primary Examiner: FEELY, MICHAEL J    Event publication date=2015-02-19  Event code=US/ART  Event type=Administrative notifications  USPTO Art Group  ART=1766     Event publication date=2015-02-19  Event code=US/DK  Event type=Examination events  Attorney Docket Number Docket Nbr: 1451308.318US9 Customer Nbr: 21874    Event publication date=2015-02-19  Event code=US/ENT  Event type=Administrative notifications  Business Entity Status: UNDISCOUNTED    Event publication date=2015-02-19  Event code=US/AIA  Event type=Administrative notifications  First Inventor File Indicated:  AIA=Yes     Event publication date=2016-12-02  Event code=US/AS  Event type=Change of name or address  Event type=Reassignment  Assignment Owner: DIC CORPORATION, JAPAN  Effective date of the event=2016-11-21  ASSIGNMENT OF ASSIGNORS INTEREST ASSIGNORS:SHIMONO, TOMOHIRO ARITA, KAZUO REEL/FRAME:040495/0295     Event publication date=2016-12-02  Event code=US/PTARDY  Event indicator=Pos  Event type=Examination events  Patent Term Adjustment - Ready for Examination    Event publication date=2016-12-02  Event code=US/IDS  Event type=Examination events  Event type=OAI  Information Disclosure Statement Filed    Event publication date=2016-12-02  Event code=US/ENTYSTA  Event type=Administrative notifications  Entity Status Set to Undiscounted    Event publication date=2017-01-05  Event code=US/M903  Event indicator=Pos  Event type=Examination events  Event type=OAO  Notice of DO/EO Acceptance Mailed    Event publication date=2017-01-05  Event code=US/APPFILEREC  Event type=Administrative notifications  Event type=OAO  Filing Receipt    Event publication date=2017-01-27  Event code=US/DKNC  Event indicator=Pos  Event type=Examination events  Docketed New Case - Ready for Examination    Event publication date=2017-01-27  Event code=US/DOCK  Event indicator=Pos  Event type=Examination events  Case Docketed to Examiner in GAU    Event publication date=2017-04-13  Event code=US/A1  Event type=Examination events  Application published  Publication country=US  Publication number=US2017101532  Publication stage Code=A1  Publication date=2017-04-13  Standardized publication number=US20170101532     Event publication date=2017-04-13  Event code=US/PGPUBN  Event indicator=Pos  Event type=Examination events  Event type=OAO  PG-Pub Issue Notification
专利类型码
A1
国别省市代码
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