Modified resin systems suitable for liquid resin infusion 机翻标题: 暂无翻译,请尝试点击翻译按钮。

公开号/公开日
IN201747020416 A 2017-06-23 [IN201747020416] / 2017-06-23
申请号/申请日
2017IN-47020416 / 2017-06-12
发明人
MEEGAN Jonathan E;Olivia DENMAN;Marco AURILIA;
申请人
CYTEC INDUSTRIES;
主分类号
IPC分类号
B29C-070/34C08G-059/50C08K-003/00
摘要
(IN201747020416) A curable composition for liquid resin infusion (LRI) and a manufacturing process for producing a molded article.  The curable composition includes: a) no more than 5.0 wt% of a thermoplastic polymer; b) no more than 5.0 wt% of nano sized core shell particles; c) no more than 5.0 wt% of nano sized inorganic particles; d) an epoxy resin component; and e) one or more amine curing agent(s) wherein the initial viscosity of said curable composition is no more than 5 Poise at a temperature within the temperature range of from about 80°C to about 130°C.
机翻摘要
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地址
代理人
代理机构
;
优先权号
2014GB-0022564 2014-12-18
主权利要求
(IN201747020416)  1. A liquid resin infusion (LRI) manufacturing process for producing a molded article, Comprising the steps of providing a curable composition, injecting said curable composition into a mold, and curing said curable composition, wherein ihe curable composition comprises;   A) no more than 5.0 wt% of a thermoplastic polymer;   B) no more than 5.0 wt% of core-shell particles wherein said core-shell particles have a particle size in the range of from about 50 nm to about 800 nm;   C) no more than 5.0 wt% of inorganic particles wherein said inorganic particles have a particle size in the range of from about 2.0 nm to about 800 nm;   D) an epoxy resin component which is or comprises one or more epoxy resin precursor(s);  and e) one or more amine curing agent(s), Wherein ihe initial viscosity of said curable composition is no more than 5 Poise at a temperature within the temperature range of from about 8Q*C to about 130.deg.C. 2. A process according to claim 1 wherein the thermoplastic polymer and the epoxy resin component form a continuous phase in the curable composition. 3. A process according to any preceding claim wherein said molded article exhibits a self-assembled shelled morphology of inorganic particles around phase-separated thermoplastic polymer domains, wherein said self-assembled shelled morphology of inorganic particles around phase-separated thermoplastic polymer domains is generated in situ during curing. 4. A process according to claim 3 wherein said self-assembled shelled morphology of inorganic particles around a phase-separated thermoplastic polymer domain has dimensions quantifiable in three orthogonal directions such that its dimensions in all three directions are greater than 1000 nm. 5. A process according to any preceding claim wherein said molded articie exhibits a Compression Strength After Impact (CSAI) of at least 220 MP a and preferably also a hot-wet open-hoie compression (H/W-OHC) strength of at least 190 MPa. 6. A process according to any preceding claim wherein said viscosity of the curable composition is no more than 2 Poise, preferably no more than about 0.5 Poise, and/or wherein said viscosity is measured at a temperature of 120CC. 7. A process according to any preceding claim wherein the viscosity of said curable composition after 3 hours at a temperature within the temperature range of from SOX to 130.deg.C, and preferably at a temperature of 120 .deg.C, is no more than 5 Poise, preferably no more than 1 Poise. 8. A process according to any preceding claim wherein the molded article is a composite material further comprising reinforcing fibrous material. 9. A process according to any preceding claim which comprises the steps of;   (i) preparing a preform comprising reinforcing fibrous material;   (il) laying the preform within a moid;   (iii) optionally heating the moid to a predetermined temperature;   (iv) providing said curable composition;   (v) injecting the curable composition into the moid, and (vi) curing said curable composition. 10. A process according to any preceding claim wherein the process is selected from Resin Transfer Molding (RTM) and Vacuum-Assisted Resin Transfer Maiding (VARTM). 11. A process according to claim 9 or 10 wherein the preform comprises one or more layers of fabric comprising reinforcing fibrous material. 12. A process according to claim 9, 10 or 11 wherein the mold is heated to a predetermined temperature in the range of from about 90,5C to about 12QC,C. 13. A process according to any preceding claim wherein curing is performed at a cure temperature (Tc) in the range from about 160/'C to about 200"C, preferably wherein the cure temperature (Tc) is attained by heating at a cure ramp rate (RCR) in the range of from about 0.5.deg.C/min to about S. O^C/min and/or the cure temperature is maintained for a period in the range of from about SO minutes to about 180 minutes. 14. A process according to any preceding claim wherein the step of providing the curable composition comprises an initial step of mixing the resin precursor component(s) with said thermoplastic component and said particles, optionally followed by a cooling step, and followed by addition of curing agent(s), and preferably wherein the resin precursor componeni(s) are mixed first with said thermoplastic component, followed by mixing with the core-shell particles and inorganic particles. 15. A process according to claim 14 wherein the curable composition comprises a plurality of resin precursor components and two or more of said plurality of resin precursor components are pre-rnlxed prior to the addition of said thermoplastic component and said particles. 16. A process according to claim 14 or 15 wherein the core-shei! particles are added as a masterbaich in a resin precursor component and/or the inorganic particles are added as a masterbaich in a resin precursor component. 17. A process according to any preceding claim wherein the thermopiastic polymer is selected from polyaryiethers, poiyaryjsuiphides and poiyaryisuiphones and copolymers thereof including poiyarylether-suiphones, and polyarylsuiphide-suiphones. 18. A process according to any preceding claim wherein the thermoplastic polymer is selected from polyarylethersulphone thermopiastic polymers comprising ether-linked repeating units, optionally further comprising thicether-finked repeating units, the units being selected from: -[ArSOzAr]n-and optionally from: -[Ar3,-w he rein: Ar is phenyiene;  n - 1 to 2 and can be fractional;   A = 1 to 3 and can be fractional and when a exceeds 1, said phenyiene groups are linked linearly through a single chemical bond or a divalent group other than -SQr: preferably wherein the divalent group is a group -C(R9)2- wherein each R9 may he the same or different and selected from H and Chalky! and preferably selected from methyl, or are fused together, provided that the repeating unit -[ArS02Ar3ri- is always present in the polyarylethersulphone in such a proportion that on average at least two of said -[ArS02Ar]n- units are in sequence in each polymer chain present, and wherein the polyarylethersulphone has one or more reactive pendant and/or end group(s). 19. A process according to any preceding claim wherein the resin precursor component is or comprises one or more epoxy resin precursor(s) having al least two epoxide groups per molecule. 20. A process according to any preceding claim resin precursor component Is a blend of epoxy resin precursors having the same or different functionality, wherein said blend comprises one or more epoxy resin precursors (P2) having two epoxide groups per moiecule, and/or one or more epoxy resin precursors (P3) having three epoxide groups per molecule, and/or one or more epoxy resin precursors (P4) having four epoxide groups per molecule, wherein said blend comprises;   (i) from about 0 wt% to about GO wt% of epoxy resin precursor(s) (P2);   (li) from about 0 wt% to about 55 wt% of epoxy resin precursor(s) (P3);  and (lii) from about 0 wt% to about BO wt% of epoxy resin precursor(s) (P4). 21. A process according to any preceding claim, wherein the resin precursor component comprises a blend of di-functlonai, tsi-functional and tetra-functional epoxy resin precursors. 22. A process according to any preceding claim wherein the resin precursor component is or comprises one or more epoxy resin precursor(s) selected from the digiycidyl ether of bisphenoi A (DGEBA);  the digiycidyl ether of bisphenoi F (DGEBF);  0:N,N-tngiycidyl-para-aminophenoj (TGPAP);  O. N. N-triglycidyl-meta-aminophenol (TGMAP);  and N. N. N'. N1-tetragiycldyldiaminodiphenyi methane (TGDDM), and blends thereof. 23. A process according to any preceding claim wherein said curable composition is thermally curable. 24. A process according to any preceding claim wherein said amine curing agent(s) are selected from aromatic amine curing agents having at least two amino groups per molecule, and preferably selected from aniline-based curing agents, and preferably from 4,4'methyienebis-(3-chioro, 2,6-diethyl)-aniline (MCDEA);  4(4'methylenebis-(2(6-diethyl)-aniline (fvlDEA);  4,4'-methylenedianiiine (MDA);  and 3,3'- and 4-,4'-diaminodiphenylsulphone (DOS). 25. A process according to any preceding ciairn wherein the epoxy resin component and the amine curing agent are preferably present in the composition in amounts sufficient to provide a molar ratio of amine groups present in the curing agent ;  epoxy groups present in \he epoxy component of from about 0.75:1 to about 1:0.75, and preferably about 1:1. 26. A process according to any preceding claim wherein the curable composition comprises from about 0.5 wt% to about 4.0 wt% of said thermoplastic polymer. 27. A process according to any preceding claim wherein the curable composition comprises from about 0.3 wt% to about 4.0 wt% core-she!! particles and/or wherein said core-shell particles have a particle size in the range of from about 100 nm to about 200 nm. 28. A process according to any preceding claim wherein said core-shell particles comprise an inner core portion and an outer sheil portion which substantially encases the inner core portion, wherein the inner core portion is an eiastorneric polymeric material preferably having a glass transition temperature less than about O^C, and wherein the outer shell portion is a polymeric materia! having a glass transition temperature greater than ambient temperature, and preferably greater than about 50;  ,C. 29. A process according to any preceding claim wherein the core-shell particles comprise an inner core portion which is a polymeric material selected from homo polymers of isoprene or butadiene, and from copolymers of isoprene or butadiene with up to about 30mol% of a vinyl eomonomer preferably selected from sfyrene, aikylstyrene, acryfonitrlle and an alky! methacrylate. 30. A process according to any preceding claim wherein the core-shell particles comprise an outer shell portion which Is a polymeric materia! selected from homopofymers of styrene, aikylstyrene and methyl methacrylate, and from copolymers comprising at least 70 moi% of a monomer seiected from styrene, aikylstyrene and methylmethacrylate and further comprising at least one different eomonomer selected from styrene. aikylstyrene, methylmethacrylate, vinyl acetate and acrylonitrlle, wherein said polymeric materia! of the outer shell portion is optionally functionalized by introducing therein one or more unsaturated functional monomers. 31. A process according to any preceding claim wherein the polymeric materia! of the inner core portion is selected from polybutadiene-styrene copolymers and polybutadiene, and blends thereof, and/or the polymeric material of the outer shell portion is a homopolymer or copolymer of methylmethacrylate, optionally functionalised and/or cross-linked. 32. A process according to any preceding claim wherein said inorganic particles are selected from calcium carbonate, Si02, Ti02 and A!203, and preferably from silica. 33. A process according to any preceding claim wherein the curable composition comprises from about 0.1 wt% to about 4.0 wt% inorganic particles and/or wherein said inorganic particles have a particle size in the range of from about 2.0nm to about lOOnm. 34. A curable composition which comprises: A) no more than 5.0 wt% of a thermoplastic polymer;   B) no more than 5.0 wt% of core-sheii particles wherein said core-shell particles have a particle size In the range of from about 50 nmto about 800 nm;   C) no more than 5.0 wt% of Inorganic particles wherein said inorganic particles have a particle size in the range of from about 2.0 nm to about 800 nm;   D) an epoxy resin component which is or comprises one or mors epoxy resin precursors);  and e) one or more amine curing agent(s), Wherein the viscosity of said curable composition is no more than 5 Poise at a temperature within the temperature range of from about SOX to about 130:C, 35. A cured molded article derived from the curable composition defined in claim 34. 36. A cured molded article according to claim 35 wherein the cured composition exhibits a self-assembled shelled morphology of inorganic particles around phase-separated thermoplastic polymer domains, preferably wherein said self-assembled shelled morphology of inorganic particles around a phase-separated thermoplastic polymer domain has dimensions quantifiable in three orthogonal directions such that its dimensions in all three directions are greater than 1000 nm. 37. A cured molded article according to claim 35 or 36 which is a composite material further comprising reinforcing fibrous material. 38. A cured molded article according to any of claims 35 to 37 wherein said molded article exhibits a Compression Strength After Impact (CSAl) of at least 220 MPa;  and preferably also a hot-wet open-hole compression (H/W-OHC) strength of at least 190 EVlPa. 38. The use of a curable composition in a liquid resin infusion (LRI) process wherein said composition comprises: A) no more than 5.0 wt% of a thermoplastic polymer;  B) no more than 5.0 wt% of core-shell particles wherein said core-shell particles have a particle size in the range of from about 50 nm to about 800 nm;  C) no more than 5.0 wt% of inorganic particles wherein said inorganic particles have a particle size in the range of from about 2.0 nm to about 800 nm;  D) an epoxy resin component which is or comprises one or more epoxy resin precursor(s): and E) one or more amine curing agent(s), wherein the initial viscosity of said curable composition is no more than 5 Poise at a temperature within the temperature range of from about SOX to about ISO'C, for the purpose of improving Compression Strength After impact (CSAI) in a cured resin (particularly a composite material) produced from said curable composition in said LRI process, preferably while maintaining hot-wet open hole compression strength (H/W OHC strength) and maintaining the processability of ihe curable composition, and preferably for the purpose of improving CSAI while maintaining H/W OHC strength and improving processability of the curable composition. 40. The use according to claim 39 wherein the CSA! of said cured resin (particularly said composite material) is at least 220 MPa, preferably wherein the H/W-GHC strength of said cured resin (particularly said composite material) is at least 190 MPa and/or preferably wherein the initiai viscosity of said curable composition is no more than 5 Poise at a temperature within the temperature range of from about 80.deg.C to about 130*C and the viscosity of said curable composition after 3 hours at a temperature within the temperature range of from 8CTC to 13G.deg.C is no more than 5 Poise. 41. A curable composition according to claim 34 or a cured molded article according to any of claims 35 to 38 or a use according to claim 39 or 40 wherein said curable composition is as defined in any of claims 2, 6, 7 or 17 to 33.
法律状态
(IN201747020416) LEGAL DETAILS FOR IN201747020416  Actual or expected expiration date=2037-06-12    Legal state=ALIVE    Status=PENDING     Event publication date=2017-06-12  Event code=IN/APP  Event indicator=Pos  Event type=Examination events  Application details  Application country=IN IN201747020416  Application date=2017-06-12  Standardized application number=2017IN-47020416     Event publication date=2017-06-23  Event code=IN/A  Event indicator=Pos  Event type=Examination events  Application laid open  Publication country=IN  Publication number=IN201747020416  Publication stage Code=A  Publication date=2017-06-23  Standardized publication number=IN201747020416
专利类型码
A
国别省市代码
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