Dicing sheet with protective film forming layer and method for producing chip 机翻标题: 暂无翻译,请尝试点击翻译按钮。

源语言标题
(JP2016219841) 保護​膜​形成​層​付​ダイシングシート​および​チップ​の​製造​方法
公开号/公开日
JP2016219841 A 2016-12-22 [JP2016219841] / 2016-12-22
申请号/申请日
2016JP-0170088 / 2016-08-31
发明人
SAEKI NAOYA;SHINODA TOMONORI;TAKANO TAKESHI;
申请人
LINTEC;
主分类号
IPC分类号
B32B-027/00C09D-007/12C09D-163/00C09D-201/00C09J-007/02C09J-011/08C09J-201/00H01L-021/301
摘要
(JP2016219841) PROBLEM TO BE SOLVED: To provide a dicing sheet with a protective film formation layer which can easily produce a semiconductor chip having a protective film having high uniformity and superior printing precision, can easily perform peeling between the protective film and the dicing sheet, and has superior affixing ability of chips during dicing.SOLUTION: A dicing sheet with a protective film formation layer includes an energy ray curable protective film formation layer which is provided on, in a peelable manner, an adhesive layer of an adhesive sheet in which the adhesive layer containing an adhesive component and a free epoxy group-containing compound by being laminated onto a substrate film.SELECTED DRAWING: Figure 1
机翻摘要
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地址
代理人
代理机构
;
优先权号
2012JP-0184167 2012-08-23
主权利要求

        
法律状态
(JP2016219841) LEGAL DETAILS FOR JP2016219841  Actual or expected expiration date=2033-08-22    Legal state=ALIVE    Status=PENDING     Event publication date=2016-08-31  Event code=JP/APP  Event indicator=Pos  Event type=Examination events  Application details  Application country=JP JP2016170088  Application date=2016-08-31  Standardized application number=2016JP-0170088     Event publication date=2016-12-22  Event code=JP/A  Event indicator=Pos  Event type=Examination events  Published application  Publication country=JP  Publication number=JP2016219841  Publication stage Code=A  Publication date=2016-12-22  Standardized publication number=JP2016219841     Event publication date=2017-05-30  Event code=JP/A131  Event indicator=Neg  Event type=Examination events  Notification of reasons for refusal  Effective date of the event=2017-05-30  JAPANESE INTERMEDIATE CODE: A131     Event publication date=2017-06-02  Event code=JP/A977  Event type=Examination events  Report on retrieval  Effective date of the event=2017-05-31  JAPANESE INTERMEDIATE CODE: A971007     Event publication date=2017-07-26  Event code=JP/A521  Event type=Restitution or restoration  Written amendment  Effective date of the event=2017-07-26  JAPANESE INTERMEDIATE CODE: A523
专利类型码
A
国别省市代码
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