(JP2016219841) PROBLEM TO BE SOLVED: To provide a dicing sheet with a protective film formation layer which can easily produce a semiconductor chip having a protective film having high uniformity and superior printing precision, can easily perform peeling between the protective film and the dicing sheet, and has superior affixing ability of chips during dicing.SOLUTION: A dicing sheet with a protective film formation layer includes an energy ray curable protective film formation layer which is provided on, in a peelable manner, an adhesive layer of an adhesive sheet in which the adhesive layer containing an adhesive component and a free epoxy group-containing compound by being laminated onto a substrate film.SELECTED DRAWING: Figure 1
(JP2016219841) LEGAL DETAILS FOR JP2016219841 Actual or expected expiration date=2033-08-22 Legal state=ALIVE Status=PENDING Event publication date=2016-08-31 Event code=JP/APP Event indicator=Pos Event type=Examination events Application details Application country=JP JP2016170088 Application date=2016-08-31 Standardized application number=2016JP-0170088 Event publication date=2016-12-22 Event code=JP/A Event indicator=Pos Event type=Examination events Published application Publication country=JP Publication number=JP2016219841 Publication stage Code=A Publication date=2016-12-22 Standardized publication number=JP2016219841 Event publication date=2017-05-30 Event code=JP/A131 Event indicator=Neg Event type=Examination events Notification of reasons for refusal Effective date of the event=2017-05-30 JAPANESE INTERMEDIATE CODE: A131 Event publication date=2017-06-02 Event code=JP/A977 Event type=Examination events Report on retrieval Effective date of the event=2017-05-31 JAPANESE INTERMEDIATE CODE: A971007 Event publication date=2017-07-26 Event code=JP/A521 Event type=Restitution or restoration Written amendment Effective date of the event=2017-07-26 JAPANESE INTERMEDIATE CODE: A523
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