Low temperature melt injected anti-microbial films, articles containing such films and methods of manufacture and use thereof 机翻标题: 暂无翻译,请尝试点击翻译按钮。

公开号/公开日
US6004667 A 1999-12-21 [US6004667] / 1999-12-21
申请号/申请日
1994US-08269174 / 1994-06-30
发明人
SAKURADA TSUKASA;HASHIMOTO AKIHIKO;
申请人
SHINSHU CERAMICS;
主分类号
IPC分类号
A01N-059/16A61L-015/18A61L-015/46
摘要
(US6004667) An article having anti-microbial properties which includes a low temperature melt injected film containing an interconnected network of resolidified photosemiconductor and conductor particles.  The anti-microbial film also may include adsorbent particles for adsorbing microorganisms.  Methods of manufacture of such articles, methods for treating infections, and methods for sterilizing fluids, also are provided.
机翻摘要
暂无翻译结果,您可以尝试点击头部的翻译按钮。
地址
代理人
代理机构
;
优先权号
1994US-08269174 1994-06-30
主权利要求
(US6004667) What is claimed is: 1.  An article including an anti-microbial film which contains a porous network of interconnected low temperature melt injected and resolidified photosemiconductor and conductor particles wherein said anti-microbial film further includes active unmelted adsorbent particles for trapping microorganisms, said conductor particles having a melting temperature lower than a deactivating temperature of said active adsorbent particles. 2. The article recited in claim 1 wherein said article includes a conductive metal plating which is attached to said anti-microbial film. 3. The article recited in claim 1 wherein said photosemiconductor particles are selected from the group consisting of TiO2, SrTiO3, KNbO3, CdSe, CdS, WO3, Fe2 O3 and mixtures thereof. 4. The article recited in claim 1 wherein said conductor particles are selected from the group consisting of Ni, Ag, Ni containing metals, Ag containing metals and mixtures thereof. 5. The article recited in claim 1 wherein said conductor particles exhibit an anti-microbial effect in darkness. 6. The article recited in claim 1 further including a water retentive member fluidly communicable with said anti-microbial film. 7. The article recited in claim 1 wherein a vapor impermeable seal is provided around said anti-microbial film. 8. The article recited in claim 1 wherein said active adsorbent particles are selected from the group consisting of apatite, zeolite, activated carbon and mixtures thereof. 9. The article recited in claim 8 wherein said active apatite adsorbent particles include hydroxyapatite. 10. The article recited in claim 1 wherein said article is a heat susceptible material. 11. The article recited in claim 10 wherein said heat susceptible material includes a surface which is electroless metal plated. 12. The article recited in claim 11 wherein said heat susceptible material is flexible. 13. The article recited in claim 1 wherein said article is a filter. 14. The article recited in claim 1 wherein said article is a bandage. 15. An article having anti-microbial properties, comprising: a substrate; an anti-microbial film attached to said substrate, said film including a first layer having a porous network of active unmelted adsorbent particles joined with conductive particles and a second layer having a porous network of interconnected low temperature melt injected and resolidified photosemiconductor and conductor particles, wherein said conductor particles in said first layer have a melting temperature lower than a deactivating temperature of said active adsorbent particles in said first layer. 16. The article recited in claim 15 wherein said first layer is positioned between said second layer and said substrate. 17. The article recited in claim 15 wherein said second layer is positioned between said first layer and said substrate. 18. The article recited in claim 15 wherein said first layer further includes resolidified and non-active adsorbent particles. 19. The article recited in claim 15 wherein said first layer conductive particles have a melting point which is lower than a decomposition temperature of an OH group in said active adsorbent particles. 20. The article recited in claim 15 wherein said adsorbent particles includes unmelted large active adsorption fragments and small melted and resolidified non-active adsorption fragments. 21. The article recited in claim 20 wherein said small resolidified non-adsorption active fragments secure said large active adsorption fragments to said anti-microbial film. 22. The article recited in claim 15 wherein said resolidified conductive particles in said second layer secure said adsorbent particles to said anti-microbial film. 23. The article recited in claim 15 wherein said substrate is heat susceptible. 24. The article recited in claim 23 wherein said heat susceptible substrate is flexible. 25. An article having anti-microbial properties, comprising: a substrate; a melt injected film attached to said substrate containing a porous network of active unmelted adsorbent particles for trapping microorganisms and melted and resolidified conductor particles which support said active unmelted adsorbent particles, wherein said conductor particles have a melting temperature lower than a deactivating temperature of said active adsorbent particles. 26. The article recited in claim 25 wherein said melted and resolidified conductor particles include non-active adsorbent particles. 27. The article recited in claim 25 wherein said conductive particles include particles having anti-microbial affect. 28. The article recited in claim 25 wherein said anti-microbial conductive particles are selected from the group consisting of silver, silver containing metals, nickel, nickel containing metals and mixtures thereof. 29. The article recited in claim 25 wherein said substrate includes a conductive coating. 30. An article having anti-microbial properties, comprising: a substrate; an anti-microbial film attached to said substrate, said film including a porous network of active adsorbent particles and melted and resolidified photosemiconductor and conductor particles, all of which are intimately mixed so that adsorption and sterilization functions occur. 31. The article recited in claim 30 wherein said active adsorbent particles are supported by said melted and resolidified particles. 32. The article recited in claim 31 wherein said melted and resolidified particles include non-active adsorbent particles. 33. The article recited in claim 31 wherein said melted and resolidified particles include conductive metal particles. 34. The article recited in claim 30 wherein said film includes a first layer containing active adsorbent and conductor particles and a second layer containing photosemiconductor and conductor particles.
法律状态
(US6004667) LEGAL DETAILS FOR US6004667  Actual or expected expiration date=2016-12-21    Legal state=DEAD    Status=EXPIRED     Event publication date=1994-06-30  Event code=US/APP  Event indicator=Pos  Event type=Examination events  Application details  Application country=US US08269174  Application date=1994-06-30  Standardized application number=1994US-08269174     Event publication date=1994-06-30  Event code=US/EXMR  Event type=Administrative notifications  USPTO Examiner Name Primary Examiner: LE, HOA T    Event publication date=1994-06-30  Event code=US/ART  Event type=Administrative notifications  USPTO Art Group  ART=1773     Event publication date=1994-06-30  Event code=US/DK  Event type=Examination events  Attorney Docket Number Docket Nbr: S11887000    Event publication date=1994-06-30  Event code=US/SMALL  Event type=Administrative notifications  Appl Has Filed a Verified Statement of Micro to Small Entity Status Business Entity Status: SMALL    Event publication date=1994-06-30  Event code=US/AIA  Event type=Administrative notifications  First Inventor File Indicated:  AIA=No     Event publication date=1994-07-29  Event code=US/INCD  Event type=Examination events  Event type=OAO  Notice Mailed--Application Incomplete--Filing Date Assigned    Event publication date=1994-08-30  Event code=US/AS  Event type=Change of name or address  Event type=Reassignment  Assignment  Effective date of the event=1994-08-30  ASSIGNMENT OF ASSIGNORS INTEREST ASSIGNORS:SAKURADA, TSUKASA HASHIMOTO, AKIHIKO REEL/FRAME:007135/0009     Event publication date=1994-11-03  Event code=US/IDS  Event type=Examination events  Event type=OAI  Information Disclosure Statement Filed    Event publication date=1995-04-10  Event code=US/DOCK  Event indicator=Pos  Event type=Examination events  Case Docketed to Examiner    Event publication date=1995-06-26  Event code=US/RESTREQ  Event type=Examination events  Event type=Corrections  Event type=OAO  Restriction/Election Requirement    Event publication date=1996-01-19  Event code=US/ABNOA  Event indicator=Neg  Event type=Event indicating Not In Force  Event type=OAO  Abandoned -- Failure to Respond to an Office Action    Event publication date=1996-03-07  Event code=US/PET  Event type=APL  Petition Entered    Event publication date=1997-05-28  Event code=US/CTNF  Event type=Examination events  Event type=OA  Event type=OAO  Non-Final Rejection    Event publication date=1997-05-28  Event code=US/WDPUBABN  Event indicator=Pos  Event type=Examination events  Event type=Restitution or restoration  Withdraw Publication/Pre-Exam Abandon    Event publication date=1997-12-03  Event code=US/CTNFR  Event type=Examination events  Event type=OAI  Response after Non-Final Action    Event publication date=1997-12-03  Event code=US/136G  Event type=OAO  Request for Extension of Time - Granted    Event publication date=1998-03-18  Event code=US/NOAM  Event indicator=Pos  Event type=Examination events  Event type=OAO  Mail Notice of Allowance    Event publication date=1998-03-18  Event code=US/EXAC  Event type=Examination events  Event type=OAO  Examiner's Amendment Communication    Event publication date=1999-01-25  Event code=US/PET  Event type=APL  Petition Entered    Event publication date=1999-08-10  Event code=US/DCTC  Event type=OAO  Terminal Disclaimer Approved in TC    Event publication date=1999-09-23  Event code=US/APRDY  Event indicator=Pos  Event type=Examination events  Application Is Considered Ready for Issue    Event publication date=1999-12-09  Event code=US/PAT  Event indicator=Pos  Event type=Event indicating In Force  Patented Case    Event publication date=1999-12-10  Event code=US/ISSM  Event indicator=Pos  Event type=Examination events  Event type=OAO  Event type=Restitution or restoration  Issue Notification Mailed    Event publication date=1999-12-21  Event code=US/A  Event indicator=Pos  Event type=Event indicating In Force  Patents Granted before 2001-04-15  Publication country=US  Publication number=US6004667  Publication stage Code=A  Publication date=1999-12-21  Standardized publication number=US6004667     Event publication date=2002-08-30  Event code=US/SMALL  Event type=Administrative notifications  Appl Has Filed a Verified Statement of Micro to Small Entity Status    Event publication date=2003-01-07  Event code=US/NMFP  Event type=Payment or non-payment notifications  Publication of First Notice of Maintenance Fees Payable. PAYMENT NOTICE YEAR:  Year of payment of annual fees=3     Event publication date=2003-06-23  Event code=US/FPAY  Event indicator=Pos  Event type=Event indicating In Force  Event type=Payment or non-payment notifications  Fee payment recorded   Annual fees payment date=2003-06-23     Year of payment of annual fees=4     Event publication date=2007-01-02  Event code=US/NMFP  Event type=Payment or non-payment notifications  Publication of First Notice of Maintenance Fees Payable. PAYMENT NOTICE YEAR:  Year of payment of annual fees=7     Event publication date=2007-07-05  Event code=US/REMI  Event type=Administrative notifications  Maintenance fee reminder mailed    Event publication date=2007-07-11  Event code=US/FPAY  Event indicator=Pos  Event type=Event indicating In Force  Event type=Payment or non-payment notifications  Fee payment recorded   Annual fees payment date=2007-07-11     Year of payment of annual fees=8     Event publication date=2007-07-11  Event code=US/SULP  Event indicator=Pos  Event type=Restitution or restoration  Event type=Event indicating In Force  Surcharge for late payment   Annual fees payment date=2007-07-11     Year of payment of annual fees=7     Event publication date=2011-01-04  Event code=US/NMFP  Event type=Payment or non-payment notifications  Publication of First Notice of Maintenance Fees Payable. PAYMENT NOTICE YEAR:  Year of payment of annual fees=11     Event publication date=2011-06-21  Event code=US/FPAY  Event indicator=Pos  Event type=Event indicating In Force  Event type=Payment or non-payment notifications  Fee payment recorded   Annual fees payment date=2011-06-21     Year of payment of annual fees=12     Event publication date=2016-12-21  Event code=US/EEDX  Event indicator=Neg  Event type=Event indicating Not In Force  Patent has expired
专利类型码
A
国别省市代码
若您需要申请原文,请登录。

最新评论

暂无评论。

登录后可以发表评论

意见反馈
返回顶部