(US6004667) An article having anti-microbial properties which includes a low temperature melt injected film containing an interconnected network of resolidified photosemiconductor and conductor particles. The anti-microbial film also may include adsorbent particles for adsorbing microorganisms. Methods of manufacture of such articles, methods for treating infections, and methods for sterilizing fluids, also are provided.
(US6004667) What is claimed is: 1. An article including an anti-microbial film which contains a porous network of interconnected low temperature melt injected and resolidified photosemiconductor and conductor particles wherein said anti-microbial film further includes active unmelted adsorbent particles for trapping microorganisms, said conductor particles having a melting temperature lower than a deactivating temperature of said active adsorbent particles. 2. The article recited in claim 1 wherein said article includes a conductive metal plating which is attached to said anti-microbial film. 3. The article recited in claim 1 wherein said photosemiconductor particles are selected from the group consisting of TiO2, SrTiO3, KNbO3, CdSe, CdS, WO3, Fe2 O3 and mixtures thereof. 4. The article recited in claim 1 wherein said conductor particles are selected from the group consisting of Ni, Ag, Ni containing metals, Ag containing metals and mixtures thereof. 5. The article recited in claim 1 wherein said conductor particles exhibit an anti-microbial effect in darkness. 6. The article recited in claim 1 further including a water retentive member fluidly communicable with said anti-microbial film. 7. The article recited in claim 1 wherein a vapor impermeable seal is provided around said anti-microbial film. 8. The article recited in claim 1 wherein said active adsorbent particles are selected from the group consisting of apatite, zeolite, activated carbon and mixtures thereof. 9. The article recited in claim 8 wherein said active apatite adsorbent particles include hydroxyapatite. 10. The article recited in claim 1 wherein said article is a heat susceptible material. 11. The article recited in claim 10 wherein said heat susceptible material includes a surface which is electroless metal plated. 12. The article recited in claim 11 wherein said heat susceptible material is flexible. 13. The article recited in claim 1 wherein said article is a filter. 14. The article recited in claim 1 wherein said article is a bandage. 15. An article having anti-microbial properties, comprising: a substrate; an anti-microbial film attached to said substrate, said film including a first layer having a porous network of active unmelted adsorbent particles joined with conductive particles and a second layer having a porous network of interconnected low temperature melt injected and resolidified photosemiconductor and conductor particles, wherein said conductor particles in said first layer have a melting temperature lower than a deactivating temperature of said active adsorbent particles in said first layer. 16. The article recited in claim 15 wherein said first layer is positioned between said second layer and said substrate. 17. The article recited in claim 15 wherein said second layer is positioned between said first layer and said substrate. 18. The article recited in claim 15 wherein said first layer further includes resolidified and non-active adsorbent particles. 19. The article recited in claim 15 wherein said first layer conductive particles have a melting point which is lower than a decomposition temperature of an OH group in said active adsorbent particles. 20. The article recited in claim 15 wherein said adsorbent particles includes unmelted large active adsorption fragments and small melted and resolidified non-active adsorption fragments. 21. The article recited in claim 20 wherein said small resolidified non-adsorption active fragments secure said large active adsorption fragments to said anti-microbial film. 22. The article recited in claim 15 wherein said resolidified conductive particles in said second layer secure said adsorbent particles to said anti-microbial film. 23. The article recited in claim 15 wherein said substrate is heat susceptible. 24. The article recited in claim 23 wherein said heat susceptible substrate is flexible. 25. An article having anti-microbial properties, comprising: a substrate; a melt injected film attached to said substrate containing a porous network of active unmelted adsorbent particles for trapping microorganisms and melted and resolidified conductor particles which support said active unmelted adsorbent particles, wherein said conductor particles have a melting temperature lower than a deactivating temperature of said active adsorbent particles. 26. The article recited in claim 25 wherein said melted and resolidified conductor particles include non-active adsorbent particles. 27. The article recited in claim 25 wherein said conductive particles include particles having anti-microbial affect. 28. The article recited in claim 25 wherein said anti-microbial conductive particles are selected from the group consisting of silver, silver containing metals, nickel, nickel containing metals and mixtures thereof. 29. The article recited in claim 25 wherein said substrate includes a conductive coating. 30. An article having anti-microbial properties, comprising: a substrate; an anti-microbial film attached to said substrate, said film including a porous network of active adsorbent particles and melted and resolidified photosemiconductor and conductor particles, all of which are intimately mixed so that adsorption and sterilization functions occur. 31. The article recited in claim 30 wherein said active adsorbent particles are supported by said melted and resolidified particles. 32. The article recited in claim 31 wherein said melted and resolidified particles include non-active adsorbent particles. 33. The article recited in claim 31 wherein said melted and resolidified particles include conductive metal particles. 34. The article recited in claim 30 wherein said film includes a first layer containing active adsorbent and conductor particles and a second layer containing photosemiconductor and conductor particles.
(US6004667) LEGAL DETAILS FOR US6004667 Actual or expected expiration date=2016-12-21 Legal state=DEAD Status=EXPIRED Event publication date=1994-06-30 Event code=US/APP Event indicator=Pos Event type=Examination events Application details Application country=US US08269174 Application date=1994-06-30 Standardized application number=1994US-08269174 Event publication date=1994-06-30 Event code=US/EXMR Event type=Administrative notifications USPTO Examiner Name Primary Examiner: LE, HOA T Event publication date=1994-06-30 Event code=US/ART Event type=Administrative notifications USPTO Art Group ART=1773 Event publication date=1994-06-30 Event code=US/DK Event type=Examination events Attorney Docket Number Docket Nbr: S11887000 Event publication date=1994-06-30 Event code=US/SMALL Event type=Administrative notifications Appl Has Filed a Verified Statement of Micro to Small Entity Status Business Entity Status: SMALL Event publication date=1994-06-30 Event code=US/AIA Event type=Administrative notifications First Inventor File Indicated: AIA=No Event publication date=1994-07-29 Event code=US/INCD Event type=Examination events Event type=OAO Notice Mailed--Application Incomplete--Filing Date Assigned Event publication date=1994-08-30 Event code=US/AS Event type=Change of name or address Event type=Reassignment Assignment Effective date of the event=1994-08-30 ASSIGNMENT OF ASSIGNORS INTEREST ASSIGNORS:SAKURADA, TSUKASA HASHIMOTO, AKIHIKO REEL/FRAME:007135/0009 Event publication date=1994-11-03 Event code=US/IDS Event type=Examination events Event type=OAI Information Disclosure Statement Filed Event publication date=1995-04-10 Event code=US/DOCK Event indicator=Pos Event type=Examination events Case Docketed to Examiner Event publication date=1995-06-26 Event code=US/RESTREQ Event type=Examination events Event type=Corrections Event type=OAO Restriction/Election Requirement Event publication date=1996-01-19 Event code=US/ABNOA Event indicator=Neg Event type=Event indicating Not In Force Event type=OAO Abandoned -- Failure to Respond to an Office Action Event publication date=1996-03-07 Event code=US/PET Event type=APL Petition Entered Event publication date=1997-05-28 Event code=US/CTNF Event type=Examination events Event type=OA Event type=OAO Non-Final Rejection Event publication date=1997-05-28 Event code=US/WDPUBABN Event indicator=Pos Event type=Examination events Event type=Restitution or restoration Withdraw Publication/Pre-Exam Abandon Event publication date=1997-12-03 Event code=US/CTNFR Event type=Examination events Event type=OAI Response after Non-Final Action Event publication date=1997-12-03 Event code=US/136G Event type=OAO Request for Extension of Time - Granted Event publication date=1998-03-18 Event code=US/NOAM Event indicator=Pos Event type=Examination events Event type=OAO Mail Notice of Allowance Event publication date=1998-03-18 Event code=US/EXAC Event type=Examination events Event type=OAO Examiner's Amendment Communication Event publication date=1999-01-25 Event code=US/PET Event type=APL Petition Entered Event publication date=1999-08-10 Event code=US/DCTC Event type=OAO Terminal Disclaimer Approved in TC Event publication date=1999-09-23 Event code=US/APRDY Event indicator=Pos Event type=Examination events Application Is Considered Ready for Issue Event publication date=1999-12-09 Event code=US/PAT Event indicator=Pos Event type=Event indicating In Force Patented Case Event publication date=1999-12-10 Event code=US/ISSM Event indicator=Pos Event type=Examination events Event type=OAO Event type=Restitution or restoration Issue Notification Mailed Event publication date=1999-12-21 Event code=US/A Event indicator=Pos Event type=Event indicating In Force Patents Granted before 2001-04-15 Publication country=US Publication number=US6004667 Publication stage Code=A Publication date=1999-12-21 Standardized publication number=US6004667 Event publication date=2002-08-30 Event code=US/SMALL Event type=Administrative notifications Appl Has Filed a Verified Statement of Micro to Small Entity Status Event publication date=2003-01-07 Event code=US/NMFP Event type=Payment or non-payment notifications Publication of First Notice of Maintenance Fees Payable. 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