Curable resin composition, cured product thereof, semiconductor sealing material, semiconductor device, prepreg, circuit board, buildup film, buildup board, fiber-reinforced composite material, and fiber-reinforced resin molded article 机翻标题: 暂无翻译,请尝试点击翻译按钮。

公开号/公开日
EP3156450 A1 2017-04-19 [EP3156450] / 2017-04-19
申请号/申请日
2015EP-0805902 / 2015-02-19
发明人
SHIMONO TOMOHIRO;ARITA KAZUO;
申请人
DIC;
主分类号
IPC分类号
C08G-014/073C08G-059/40C08J-005/24C08L-061/34C08L-063/00H05K-001/03
摘要
(EP3156450) The present invention provides a curable resin composition having excellent fluidity and giving a cured product having excellent physical properties such as heat resistance, moisture resistance/solder resistance, flame retardance, and dielectric characteristics.  The curable resin composition contains a resin (A) which has a benzoxazine structure represented by structural formula (A1) below and an epoxy resin (B) at such a ratio that when the total number of moles of the benzoxazine structure of the structural formula (A1) is ±, and the number of moles of epoxy groups in the epoxy resin (B) is ², a ratio [²/±] is 0.1 to 0.5.
机翻摘要
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地址
代理人
代理机构
;
优先权号
2014JP-0122402 2014-06-13 2015WO-JP54593 2015-02-19
主权利要求
(EP3156450) 1. A curable resin composition comprising a resin (A) which has a benzoxazine structure represented by structural formula (A1) below and an epoxy resin (B) at such a ratio that when the total number of moles of the benzoxazine structure represented by the structural formula (A1) is alpha , and the number of moles of epoxy groups in the epoxy resin (B) is beta , a ratio [(beta )/(alpha )] is 0.1 to 0.5, (see diagramm) [in the structural formula (A1), Ar **1 represents a tetravalent aromatic group, Ar **2 represents a divalent aromatic group, L represents a divalent linking group, x represents an average repeating number of 0.25 to 5.0, and O ***1 atom and C ***1 atom represent bonds to adjacent carbon atoms of an aromatic group represented by Ar **1, and O ***2 atom and C ***2 atom represent bonds to adjacent carbon atoms of an aromatic group represented by Ar **2]. 20. A resin (A) having a benzoxazine structure represented by a structural formula (A1) below, (see diagramm) [in the structural formula (A1), Ar **1 represents a tetravalent aromatic group, Ar **2 represents a divalent aromatic group, L represents a divalent linking group, x represents an average repeating number of 0.25 or more and less than 2.0, and O ***1 atom and C ***1 atom represent bonds to adjacent carbon atoms of an aromatic group represented by Ar **1, and O ***2 atom and C ***2 atom represent bonds to adjacent carbon atoms of an aromatic group represented by Ar **2].
法律状态
(EP3156450) LEGAL DETAILS FOR EP3156450  Actual or expected expiration date=2035-02-19    Legal state=ALIVE    Status=PENDING     Event publication date=2015-02-19  Event code=EP/APP  Event indicator=Pos  Event type=Examination events  Application details  Application country=EP EP15805902  Application date=2015-02-19  Standardized application number=2015EP-0805902     Event publication date=2017-04-19  Event code=EP/A1  Event type=Examination events  Application published with search report  Publication country=EP  Publication number=EP3156450  Publication stage Code=A1  Publication date=2017-04-19  Standardized publication number=EP3156450     Event publication date=2017-04-19  Event code=EP/17P  Event indicator=Pos  Event type=Examination events  Request for examination filed Pruefungsantrag gestellt  Effective date of the event=2016-12-02     Event publication date=2017-04-19  Event code=EP/AK  Event indicator=Pos  Event type=Designated states  Designated contracting states: Benannte vertragsstaaten AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR    Event publication date=2017-04-19  Event code=EP/AX  Event indicator=Pos  Event type=Designated states  Extension of the European patent to Request for extension of the european patent to BA ME
专利类型码
A1
国别省市代码
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