[专利]
Particle removal method using an aqueous polyphosphate solution
申请号:
2015US-14986590
申请日:
2015-12-31
公开号:
USRE46454 E1 2017-06-27 [USRE46454]
公开日:
2017-06-27
申请人:
FONTANA TECHNOLOGY
专利权人:
FONTANA TECHNOLOGY
发明人:
BECK MARK JONATHAN
国家:
IPC:
B08B-003/00;B08B-003/04;C11D-003/06;C11D-007/00;C11D-007/16;C11D-011/00;C23G-001/00;G03F-001/82;H01L-021/02;H01L-021/67
(USRE46454) A method and cleaning solution for cleaning electronic substrates, such as a semiconductor wafers, hard disks, photomasks or imprint molds. The method comprises the steps of contacting a surface of the substrate with a cleaning solution comprised of a polyphosphate, and then removing the cleaning solution from the surface. Additional optional steps include applying acoustic energy to the cleaning solution while the cleaning solution is in contact with the surface, and removing the cleaning solution from the surface by rinsing the surface with a rinsing solution with or without the application of acoustic energy. The cleaning solution comprises a polyphosphate, such as any of the water soluble polyphosphates. Depending on the application, the cleaning solution may also comprise a base and/or a quantity of suspended particles. Complexing agents, amines, biocides, surfactants and/or other substances, may also be added to the cleaning solution.