[专利]
Dicing sheet with protective film forming layer and method for producing chip
申请号:
2016JP-0170088
申请日:
2016-08-31
公开号:
JP2016219841 A 2016-12-22 [JP2016219841]
公开日:
2016-12-22
发明人:
SAEKI NAOYA;SHINODA TOMONORI;TAKANO TAKESHI
国家:
IPC:
B32B-027/00;C09D-007/12;C09D-163/00;C09D-201/00;C09J-007/02;C09J-011/08;C09J-201/00;H01L-021/301
(JP2016219841) PROBLEM TO BE SOLVED: To provide a dicing sheet with a protective film formation layer which can easily produce a semiconductor chip having a protective film having high uniformity and superior printing precision, can easily perform peeling between the protective film and the dicing sheet, and has superior affixing ability of chips during dicing.SOLUTION: A dicing sheet with a protective film formation layer includes an energy ray curable protective film formation layer which is provided on, in a peelable manner, an adhesive layer of an adhesive sheet in which the adhesive layer containing an adhesive component and a free epoxy group-containing compound by being laminated onto a substrate film.SELECTED DRAWING: Figure 1