[专利]
Thermal conductive silicone composition and cured product, and composite sheet
申请号:
2015KR-0189657
申请日:
2015-12-30
公开号:
KR20160084808 A 2016-07-14 [KR20160084808]
公开日:
2016-07-14
申请人:
SHINETSU CHEMICAL
专利权人:
SHINETSU CHEMICAL
发明人:
ISHIHARA YASUHISA;ENDO AKIHIRO
国家:
IPC:
B32B-027/28;C08J-005/18;C08K-003/22;C08L-083/04
(KR20160084808) Provided is a thermoconductive silicone composition which contains over 90% of alpha alumina alumina of which α rate is greater than or equal to 90%, with respect to the total parts by weight of a thermoconductive filler, and shows the weight reduction rate less than 1% when exposed to air under a condition involving a temperature of 250°C for six hours. According to the present invention, the thermoconductive silicone composition using over 90% of alpha alumina of which α rate is greater than or equal to 90%, with respect to the total parts by weight of a thermoconductive filler exhibits the low weight reduction rate and excellent heat resistance even at 250°C. Therefore, the thermoconductive silicone composition and a cured product and a composite sheet can be used to cope with a condition requiring heat resistance at approximately 250°C, such as semiconductor devices using silicon carbide-based substrate materials and automobile-mountable heaters for heat radiation.