[专利]
Carrier-substrate adhesive system
申请号:
2016WO-US53719
申请日:
2016-09-26
公开号:
WO2017062202 A1 2017-04-13 [WO201762202]
公开日:
2017-04-13
申请人:
MASSACHUSETTS INSTITUTE OF TECHNOLOGY MIT
专利权人:
MASSACHUSETTS INSTITUTE OF TECHNOLOGY MIT
发明人:
SMITH HENRY I;FUCETOLA COREY P;MIRICA KATHERINE A;FUCETOLA JAY J;FREEMAN DAKOTA S
国家:
IPC:
B29C-033/60;B29C-053/84;B32B-037/26;B32B-038/10;B32B-043/00;B65H-037/04;C09J-005/06
(WO201762202) A system and method for creating three-dimensional nanostructures is disclosed. The system includes a substrate bonded to a carrier using a bonding agent. The bonding agent may be vaporizable or sublimable. The carrier may be a glass or glass-like substance. In some embodiments, the carrier may be permeable having one or a plurality of pores through which the bonding agent may escape when converted to a gaseous state with heat, pressure, light or other methods. A substrate is bonded to the carrier using the bonding agent. The substrate is then processed to form a membrane. This processing may include grinding, polishing, etching, patterning, or other steps. The processed membrane is then aligned and affixed to a receiving substrate, or a previously deposited membrane. Once properly attached, the bonding agent is then heated, depressurized or otherwise caused to sublimate or vaporize, thereby releasing the processed membrane from the carrier.