(WO2014199656) Provided are: a heat-curable resin composition which has a long pot life, enables the reduction in the amount of a surplus of the curable composition to be discarded, and enables the production of a fiber-reinforced composite material, i.e., a cured product, which is rarely colored and rarely undergoes the formation of blisters on the surface thereof when a fibrous base material is impregnated with the composition and then the resultant product is cured; and a fiber-reinforced composite material which is produced using the heat-curable resin composition. A resol-type phenolic resin composition characterized by comprising a water-soluble resol-type phenolic resin (A) produced by reacting a phenol (a1) with an aldehyde (a2) in the presence of an amine-type catalyst (a3), a water-soluble solvent (B) having a boiling point of 110 to 300˚C and water, and also characterized by having a pH value of 7 to 10; and a fiber-reinforced composite material characterized by being produced by impregnating a fibrous base material with the resol-type phenolic resin composition and then curing the resultant product.
(WO2015152037) A phenolic resin which is represented by general formula (1) and can impart a thermal expansion coefficient of 1.5% or more to a cured article, which is an article produced from the phenolic resin, an epoxy resin represented by general formula (2) and a curing accelerator, at a temperature of 40 to 180°C inclusive. The phenolic resin is preferably one which can impart a storage modulus of 15 MPa or more to the cured article at 250°C.
(WO2015137294) The purpose of the present invention is to provide a phenolic resin, phenolic resin mixture, epoxy resin, epoxy resin composition, and cured products thereof that achieve both heat resistance and low water absorption/low relative permittivity in semiconductor peripheral materials requiring these properties. This phenolic resin has a structure represented by formula (1) in the skeleton. (In the formula, R1, R2, X1, X2, X3, and X4 are each present independently; R1 and R2 represent a hydrogen atom, C1-C6 alkyl group, hydroxyl group, methoxy group, ethoxy group, nitro group, nitrile group, amino group, or optionally substituted phenyl group; and X1, X2, X3, and X4 represent a hydrogen atom or organic group, where at least one represents a hydroxy group or an organic group substituted by a hydroxy group. X1 and X2, and X3 and X4, may bond to each other and form a cyclic structure. k indicates 1-4.)
(WO201676403) A method for producing a novolac type phenolic resin by reacting phenols and saturated aliphatic aldehyde having 6-20 carbon atoms under the presence of a boron compound represented by general formula (1), B-(OR)3 (1), (in the formula, the three Rs are each independently a hydrogen atom or an alkyl group having 1-10 carbon atoms) and an acid with a pKa at 25°C of 5.0 or less.
(JP2016023265) PROBLEM TO BE SOLVED: To provide a method for producing dicyclopentadienes modified phenolic resin, in which the method has high yield and no problem such as ignition during the manufacturing process thereof, and can attain excellent color tone improving effect, and to provide dicyclopentadienes modified phenolic resin using the phenolic resin produced by producing method thereof, and an epoxy resin obtained by epoxidizing the phenolic resin, and cured product thereof.SOLUTION: A method for producing dicyclopentadienes modified phenolic resin improved in color tone includes: a blending step of adding an active carbon having an average pore radius of 0.9 nm or more to a solution comprising dicyclopentadienes modified phenolic resin and solvent, and blending them together to obtain a blended liquid; a mixing step of mixing the blended liquid; an active carbon removing step of removing the active carbon from the blended liquid to obtain a treated liquid comprising the dicyclopentadienes modified phenolic resin and the solvent; and a recovering step of removing the solvent from the treated liquid to recover the dicyclopentadienes modified phenolic resin.SELECTED DRAWING: None
(KR101632902) The present invention relates to a manufacturing method of a panel using a phenol resin, and a panel using a phenol resin manufactured by the same. The manufacturing method of a panel using a phenol resin comprises: (S100) a bakelite waste pulverizing step; (S200) a phenol resin manufacturing step; (S300) a bakelite waste powder and phenol resin mixture solution manufacturing step; (S400) a conductive polymer addition step; (S500) a substrate immersion step; (S600) a UV radiation and prepreg formation step; and (S700) a panel manufacturing step. According to the present invention, the manufacturing method can efficiently reuse waste resources causing problems of environmental contamination, and the panel manufactured using the same has improved strength and adhesive strength, while having improved electric characteristics such as antistatic properties.
(EP3150667) The phenolic resin composition of the present invention includes a novolac-type phenolic resin, a resorcinol resin, and a curing agent, and is of a solid form. The mixing ratio of the resorcinol resin is preferably more than or equal to 1 part by mass and less than or equal to 100 parts by mass with respect to 100 parts by mass of the novolac-type phenolic resin. The mixing ratio of the curing agent is preferably more than or equal to 5 parts by mass and less than or equal to 25 parts by mass with respect to 100 parts by mass of a total amount of the novolac-type phenolic resin and the resorcinol resin. The phenolic resin cured product is obtained by heat-curing the phenolic resin composition.
(JP5700873) PROBLEM TO BE SOLVED: To provide a foamable phenol resin molding material giving a phenolic resin foam excellent in mechanical strength, particularly compression strength and compressive modulus, and a phenolic resin foam having the above characteristics.SOLUTION: The above foamable phenol resin molding material is one containing an aromatic amine compound, as a further additive agent, at a proportion of 0.5 to 5 pts.mass per 100 pts.mass of a liquid resol-type phenol resin in a foamable resol type phenolic resin molding material comprising a liquid resol-type phenol resin, a foaming agent (except for chlorofluorocarbon), a foam stabilizer and an acid curing agent.
(WO2016152988) A phenolic resin foam which contains a phenolic resin and a foaming agent, and which is characterized in that: the foaming agent contains at least one halogenated unsaturated hydrocarbon; the average cell diameter is 120 μm or less; the thermal conductivity is 0.019 W/m·K or less; and the limiting oxygen index is 28% or more.
(WO2015182640) This phenolic resin composition is characterized by containing a novolak phenolic resin, a resorcinol resin, and a curing agent, and by being a solid. The content ratio of the resorcinol resin is preferably 1-100 mass parts with respect to 100 mass parts of the novolak phenolic resin. The content ratio of the curing agent is preferably 5-25 mass parts with respect to a total of 100 mass parts of the novolak phenolic resin and resorcinol resin. The phenolic resin cured product is characterized by being formed by heat curing the phenolic resin composition.