[专利]
Phenolic resin, phenolic resin mixture, epoxy resin, epoxy resin composition, and cured products thereof
申请号：
2015WO-JP56898
申请日：
2015-03-10
公开号：
WO2015137294 A1 2015-09-17 [WO2015137294]
公开日：
2015-09-17
申请人：
NIPPON KAYAKU
专利权人：
NIPPON KAYAKU
发明人：
HASEGAWA ATSUHIKO;NAKANISHI MASATAKA;EBARA SEIJI
国家：
IPC：
C08G-008/20;C08G-059/08
(WO2015137294) The purpose of the present invention is to provide a phenolic resin, phenolic resin mixture, epoxy resin, epoxy resin composition, and cured products thereof that achieve both heat resistance and low water absorption/low relative permittivity in semiconductor peripheral materials requiring these properties. This phenolic resin has a structure represented by formula (1) in the skeleton. (In the formula, R1, R2, X1, X2, X3, and X4 are each present independently; R1 and R2 represent a hydrogen atom, C1-C6 alkyl group, hydroxyl group, methoxy group, ethoxy group, nitro group, nitrile group, amino group, or optionally substituted phenyl group; and X1, X2, X3, and X4 represent a hydrogen atom or organic group, where at least one represents a hydroxy group or an organic group substituted by a hydroxy group. X1 and X2, and X3 and X4, may bond to each other and form a cyclic structure. k indicates 1-4.)
